New applications for MEMS and advances in processing technology mean that MEMS packaging is evolving rapidly.  Packaging significantly affects the MEMS device in the mechanical, electrical, thermal, electromagnetic, and other domains.  Far too many MEMS projects fail because packaging...

Members of the MEMS Consortium at the signing ceremony held April 8, 2010 IntelliSense is a founding member in the newly created Singapore Micro-Electro-Mechanical-Systems Consortium.  The group is supported by the Singapore Economic Development Board (EDB) and Institute of Microelectronics...