New applications for MEMS and advances in processing technology mean that MEMS packaging is evolving rapidly.  Packaging significantly affects the MEMS device in the mechanical, electrical, thermal, electromagnetic, and other domains.  Far too many MEMS projects fail because packaging effects are not sufficiently considered.  We understand the inherent challenges and are focused on developing tools to help ease the “chain of pain” in package design.  Our expertise in this area is a major reason why we are working with the Institute of Microelectronics (IME) in the Singapore MEMS Consortium.  We’ve put together a presentation with some discussion on the future of MEMS packaging and how we are poised to help with package design:

MEMS Packaging Considerations (14 MB)